An international research team led by NYU Tandon School of Engineering and KAIST (Korea Advanced Institute of Science and Technology) has pioneered a new technique to identify and characterize ...
Catching all defects in chip packaging is becoming more difficult, requiring a mix of electrical tests, metrology screening, and various types of inspection. And the more critical the application for ...
A technical paper titled “Improved Defect Detection and Classification Method for Advanced IC Nodes by Using Slicing Aided Hyper Inference with Refinement Strategy” was published by researchers at ...
This study is led by Prof. Shuangyin Wang (College of Chemistry and Chemical Engineering, Hunan University) and Prof. Chen Chen (College of Chemistry and Chemical Engineering, Hunan University).
Korean researchers detect hidden semiconductor defects 1,000× more sensitively, boosting efficiency, lifespan, and design ...
Applied Materials has launched the SEMVision™ H20, a new defect review system designed to enhance the analysis of nanoscale defects in advanced semiconductor chips. This system utilizes cutting-edge ...
(Nanowerk Spotlight) The field of drug delivery has long been challenged by the need for precise, targeted methods to transport therapeutic agents within the body. Traditional approaches often ...